Products
- Advertising Screens[10]
- Packaging Machinery[9]
- Road Stud[10]
- Other Lights & Lighting Products[2]
- Ceiling Spotlights[1]
- Control Cables[10]
- Power Cables[10]
- Audio & Video Cables[10]
- CCTV Accessories[10]
- Communication Cables[10]
Contact Us
- Contact Person : Mr. Kang Jason
- Company Name : Grace (Shenzhen) Technology Co. Limited
- Tel : 86-755-33519110
- Fax : 86-755-33519110
- Address : Guangdong,shenzhen,4th floor,No47,Jingxinbei Street,Fenghuang Shequ,Pinghu,Longgang District,Shenzhen City
- Country/Region : China
- Zip : 518102
Packaging Machinery
Automatic Die Bonder LED making machine
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
DB POWER---Die Bonder Characteristics: Applied to all kind LED Die lead frame Increased output by over 80% in comparison...
Automatic Die Bonder For LED (Multi-purpose)
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
High PerformanceReal time DBI even maintain UPH 18000/Look ahead and beforeShorter process distance/preform and bongingKeep...
Automatic Die Bonder LED making machine
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
DB POWER---Die Bonder Characteristics: Applied to all kind LED Die lead frame Increased output by over 80% in comparison...
K&S ConnxLED wire bonder
1.Bonding Method: Thermosonic
2.Ultrasonic Wedge Bonding
3.Wire Diameter: 0.8-1.2 mil
4.UPH 10K
ConnxLED ---Wire Bonder Characteristic: High-speed X-Y-Z action systemThe programmable advanced image algorithmDouble-frequency ultrasonic conversion provides two...
Automatic Die Bonder LED making machine
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
Product Characteristics:KB-2600 automatic die bonders, general-purpose device specially designed for semiconductor packaging, are...
Automatic Die Bonder For LED (Multi-purpose)
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
DB POWER---Die Bonder Characteristics: Applied to all kind LED Die lead frame Increased output by over 80% in comparison...
ASM Automatic Die Bonder LED making machine
Automatic Die Bonder For LED (Multi-purpose) MB362
1.UPH: 14K
2.Work Holder Table: 10" x 4"
3.Multi-Wafer Table: 6" x 6"
Product Characteristics:KB-2600 automatic die bonders, general-purpose device specially designed for semiconductor packaging, are...
K&S ConnVLED wire bonder LED machine
1.Bonding Method: Thermosonic
2.Ultrasonic Wedge Bonding
3.Wire Diameter: 0.8-1.2 mil
4.UPH 10K
ConnxVled ---Wire Bonder Characteristic: High-speed X-Y-Z action systemThe programmable advanced image algorithm Double-frequency ultrasonic conversion...
K&S ConnVLED wire bonder
1.Bonding Method: Thermosonic
2.Ultrasonic Wedge Bonding
3.Wire Diameter: 0.8-1.2 mil
4.UPH 10K
ConnxVled ---Wire Bonder Characteristic: High-speed X-Y-Z action systemThe programmable advanced image algorithm Double-frequency ultrasonic conversion...
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